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Tantalum silicide
Basic information
Tantalum silicide is a kind of inorganic substance, which belongs to metal silicide. The chemical formula is TaSi2.
The preparation of tantalum silicide includes combustion synthesis, self-propagating high temperature synthesis, arc melting and so on. Metal silicide has similar metal conductivity, high temperature performance, oxidation resistance and compatibility with silicon integrated circuit production process. Transition metal silicide can be used for low resistance gate and internal wiring, Schottky gate, resistance contact.
Product description
Tantalum silicide has excellent properties such as high melting point, low resistivity, corrosion resistance, high temperature oxidation resistance and good compatibility with matrix materials such as silicon and carbon. Tantalum silicide is used as gate material, integrated circuit connection circuit, high temperature oxidation resistance coating and so on. it is a key material in high-tech fields such as electrothermal components, high-temperature structural components and electronic devices.
（1）It can be used as silicon nitride-tantalum silicide composite ceramic material, which can still maintain good mechanical properties and long service life in the process of working for a long time;
（2）tantalum silicide can be used as tantalum silicide coating for industrial aircraft and missile warheads.
（3） Tantalum silicide can be used for low resistance, high stability and excellent compatibility with silicon materials. Intermetallic silicide is often used as materials for electronic components such as Schottt barrier, ohmic contact and gate in large-scale integrated circuits.
（4）Tantalum silicide can be used as high performance silicon-based electrode materials.
Product parameters
|
The product name |
Tantalum silicide |
Density |
9.4g/cm3 |
Coefficient of thermal expansion |
- |
|
Molecular formula |
TaSi2 |
Melting point |
2200℃ |
Mohs hardness |
- |
|
Appearance form |
Grayish black powder |
Boiling point |
- |
Microhardness |
1407kg/mm2 |
|
CAS number |
12039-79-1 |
Resistivity |
- |
Storage mode |
Closed at room temperature, cool, ventilated and dry |
|
Molecular weight |
237.12 |
Electrical conductivity |
1.23×10-5Ω·cm-1 |
- |
- |
At present, the factory can produce products of different particle sizes, such as nanometer level, submicron level, micron level and so on. The products that have been industrially produced are-200mesh,-80mesh, 0.5 μ m, 2 μ m, 5-10 μ m and 200 μ m, all of which can be supplied at tonnage level and can be customized by customers with other granularities. The standard packing specification is 500g and 1kg, and the packing specification can be customized according to the quantity of materials put into the customer.
Further reading
Tantalum silicide: combustion synthesis or self-propagating high temperature synthesis is a method for the synthesis of intermetallic compounds using the exothermic reaction of elements / compounds. It has the advantages of simple equipment, low energy consumption and short synthesis time. Its main disadvantages are fast reaction speed, difficult process control and easy existence of miscellaneous phases. The combustion synthesis of tantalum silicide needs preheating to initiate the reaction to realize the synthesis, but there is a phase other than disilicide. Arc melting generally takes a long time to homogenize, and the loss of silicon caused by volatilization in the melting process may lead to the formation of some impurity phases. Because of its jet temperature up to 10000 ℃ and jet speed up to 300-400m/s, plasma spraying technology has the advantages of high temperature melting, rapid solidification and near-net forming, and it is not limited by shape or size, so it is easy to realize its short process forming, so it has gradually developed into a new type of parts forming technology, which has been used to prepare some parts.
Related papers
[1] Chen Minkang. Combustion synthesis and characterization of tantalum disilicide powder [D]. Harbin University of Technology, 2021.DOI:10.27061/d.cnki.ghgdu.2021.004260.
[2] Li Junfeng, Luo Zhengping. Short-term high temperature structural evolution of tantalum silicide / molybdenum silicide based thermal protective coating [J]. Rare Metal Materials and Engineering process, 2020 Journal 49 (02): 712-717.
[3] Li Xiaoyang. Study on high pressure structure and electrical transport properties of tantalum disilicide [D]. Chinese Academy of Engineering Physics, 2017.
Product Showcase
Recommended product 1:Tantalum silicide Product specifications 1-3μm
XRD spectrogram, SEM scanning electron microscopy, laser particle size
Recommended product 2: Tantalum silicide particle size 0.8μm
Product test report: SEM scan electron microscopy
Product packaging
Product purchase Q&A
Q: We use it in the lab, do you have small packages?
A: Yes, for laboratory needs, we generally have 100g/250g/500g/1kg and other packaging specifications to meet the needs of laboratory research users.
Q: I see that some companies offer 99.9% of the products, why don't you have such high-purity products?
A: The purity of the product is determined by many factors such as raw materials, production processes, testing methods and other aspects of the product. Different detection methods for the same material, may vary greatly in purity. In addition to purity concerns, you need to understand what the purity test method is to determine the reliability of this purity. It is quite possible that the actual purity of a 98% purity product and a product of 99.9% purity is much the same.
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